Method to form finFET/trigate devices on bulk semiconductor wafers

ABSTRACT

A method for fabricating a finFET device having an insulating layer that insulates the fin from a substrate is described. The insulating layer can prevent leakage current that would otherwise flow through bulk semiconductor material in the substrate. The structure may be fabricated starting with a bulk semiconductor substrate, without the need for a semiconductor-on-insulator substrate. Fin structures may be formed by epitaxial growth, which can improve the uniformity of fin heights in the devices.

BACKGROUND

1. Technical Field

The technology relates to methods and structures for making insulatedfin-field-effect transistors on bulk semiconductor wafers.

2. Discussion of the Related Art

Transistors are fundamental device elements of modern digital processorsand memory devices. Currently, there are a variety of transistor designsor types that may be used for different applications. Various transistortypes include, for example, bipolar junction transistors (BJT), junctionfield-effect transistors (JFET), metal-oxide-semiconductor field-effecttransistors (MOSFET), vertical channel or trench field-effecttransistors, and superjunction or multi-drain transistors. One type oftransistor that has emerged within the MOSFET family of transistors is afin field-effect transistor (finFET).

An example of a finFET is depicted in the perspective view of FIG. 1A. AfinFET may be fabricated on a bulk semiconductor substrate 110, e.g., asilicon substrate, and comprise a fin-like structure 115 that runs in alength direction along a surface of the substrate and extends in aheight direction normal to the substrate surface. The fin 115 may have anarrow width, e.g., less than 250 nanometers. There may be an insulatinglayer 105, e.g., an oxide layer, on a surface of the substrate. A gatestructure comprising a conductive gate material 130 and gate insulator135 may be formed over a region of the fin. A source region 120 anddrain region 140 may be formed adjacent the gate.

FIG. 1B depicts an elevation view of a finFET through a cross-sectionindicated by the dashed line in FIG. 1A. In some embodiments, a gatestructure of a finFET may include spacers 132. Line 155 indicates anapproximate vertical extent of the fin 115, and line 150 indicates anapproximate vertical extent of the gate material 130 that surrounds thefin, as depicted in FIG. 1A for example.

FinFETs have favorable electrostatic properties for complimentary MOSscaling to smaller sizes. Because the fin is a three-dimensionalstructure, the transistor's channel can be formed on three surfaces ofthe fin, so that the finFET can exhibit a high current switchingcapability for a given surface area occupied on substrate. Since thechannel and device can be raised from the substrate surface, there canbe reduced electric field coupling between adjacent devices as comparedto conventional planer MOSFETs.

SUMMARY

The described technology relates to methods and structures for makingfinFETs that are insulated from a bulk substrate. The methods do notrequire the use of semiconductor-on-insulator (SOI) substrates whenfabricating the finFETs. In various embodiments, the fin of thetransistor is supported by an insulating layer disposed underneath thefin. The insulating layer can prevent current leakage in the device thatwould otherwise occur without the insulating layer.

According to one embodiment, a method for making a finFET comprises actsof depositing a sacrificial material on a substrate, depositing a firstsemiconductor material over the sacrificial layer, and forming aplurality of fins for one or more fin-FETs in the first semiconductormaterial. A method for making a finFET may further comprise removing atleast portions of the sacrificial material to form first voids under theplurality of fins. In some embodiments, the voids may be subsequentlyfilled with an insulating material that electrically insulates the finsfrom an underlying conductive semiconductor.

There are corresponding structures associated with the methods formaking finFETs. According to one implementation, a finFET structurecomprises a plurality of semiconductor fins formed for fin-FETs, whereinthe plurality of fins are supported over voids between the plurality offins and a substrate by a support structure. The voids may be producedby removal of a sacrificial material upon which the fins were formed.

The foregoing and other aspects, embodiments, and features of thepresent teachings can be more fully understood from the followingdescription in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The skilled artisan will understand that the figures, described herein,are for illustration purposes only. It is to be understood that in someinstances various aspects of the embodiments may be shown exaggerated orenlarged to facilitate an understanding of the embodiments. In thedrawings, like reference characters generally refer to like features,functionally similar and/or structurally similar elements throughout thevarious figures. The drawings are not necessarily to scale, emphasisinstead being placed upon illustrating the principles of the teachings.Where the drawings relate to microfabrication of integrated devices,only one device may be shown of a large plurality of devices that may befabricated in parallel. The drawings are not intended to limit the scopeof the present teachings in any way.

FIG. 1A is a perspective view of a finFET formed on a bulk substrate.

FIG. 1B is an elevation view of a portion of the finFET depicted in FIG.1A.

FIGS. 2A-2I depict embodiments of process steps that may be used to forma finFET to having an underlying insulating layer on a bulksemiconductor substrate.

FIG. 3A depicts an elevation view of multiple insulated finFETs formedon a bulk semiconductor substrate.

FIG. 3B depicts an elevation view of a portion of a finFET taken alongthe dashed line of FIG. 3A.

The features and advantages of the present embodiments will become moreapparent from the detailed description set forth below when taken inconjunction with the drawings.

DETAILED DESCRIPTION

Although finFETs exhibit favorable electrostatic properties for scalingto smaller sizes and can exhibit a high current switching capability fora given surface area occupied on substrate, one shortcoming of thedevice is current leakage in an off state through the underlyingconductive substrate. For example, finFETs fabricated on bulksemiconductor substrates can exhibit current leakage in the substrateunder the fin 115 structure below the gate region. Such current leakagein a finFET is depicted in FIG. 1B as current J which represents acurrent leakage flow between source 120 and drain 140 of the device.Although this current leakage can be very small, it is undesirable on achip that may have millions of identical or similar finFETs.

One solution to preventing current leakage under the fin is to form thefins from a thin semiconductor layer comprising the insulatedsemiconductor layer of a semiconductor-on-insulator (SOI) substrate.However, the fabrication and/or use of SOI substrates can add cost tothe manufacturing process.

An additional problem associated with forming finFETs from bulksemiconductor materials, whether using SOI substrates or bulksubstrates, is that the fins may have variable heights on a same wafer,which can lead to different device properties, e.g., different thresholdvoltages V_(th) or different I-V characteristics. Referring again toFIG. 1A, the height of the fin surrounded by the gate is determined by acombination of an etching step to define the fin and a subsequentdeposition of the insulating layer 105. In some embodiments, thecombination of the etching at high aspect ratios and subsequentdeposition can lead to appreciable height variations across asemiconductor substrate.

Some of the above-described problems associated with fabrication andoperation of finFETs can be avoided using methods of fabricationdescribed below. According to some to processing embodiments describedherein, a finFET having an insulating layer below the fin to preventcurrent leakage may be formed using a bulk semiconductor substrate,rather than an SOI substrate. For example, a finFET having an underlyinginsulating layer may be formed starting with bulk semiconductor materialin which there is no buried or underlying insulating layer.Additionally, the fins may be defined using epitaxial growth ofsemiconductor material, which can lead to improved uniformity of finheights when fabricating a plurality of finFETs on a substrate.

Embodiments of processes to form multi-gate finFET devices using bulksemiconductor substrates are depicted in the process diagrams of FIGS.2A-2G. Some of the diagrams reflect the execution of more than oneprocess step. An example of a finFET fabricated according to thedisclosed processing embodiments is depicted in FIGS. 3A-3B.

Referring to FIG. 2A a process for forming a multi-gate finFET having anunderlying insulating layer may begin with providing or fabricating amulti-layer substrate 100. The multi-layer substrate may include a bulksemiconductor portion 110, also referred to as a “semiconductorsubstrate” or “substrate,” and multiple layers formed on the substrate110. The multiple layers may include, but not be limited to, a firstlayer 210, a second layer 220, and a mask layer 230.

In various embodiments, the substrate comprises a bulk semiconductormaterial of a first semiconductor type, e.g., a silicon substrate, asilicon-germanium substrate, a gallium-arsenide substrate, asilicon-carbide substrate, etc. The thickness of the substrate 110 maybe any value between approximately 5 microns (μm) and approximately 2millimeters (mm) depending upon the application. According to someembodiments, the thickness of the substrate 110 may be betweenapproximately 20 μm and approximately 500 μm. In some embodiments, athin substrate 110 may be supported by another material, e.g., apolymer, a ceramic, a metal, a glass, a handle wafer. In someembodiments, the substrate 110 may not be crystalline. The substrate 110may be of any areal size used for microfabrication purposes. Forexample, the substrate may comprise a semiconductor wafer having adiameter equal to or greater than 50 mm in some embodiments, equal to orgreater than 100 mm in some embodiments, equal to or greater than 150 mmin some embodiments, equal to or greater than 200 mm in someembodiments, and yet equal to or greater than 300 mm in someembodiments.

The first layer 210 may comprise a semiconductor material of a secondsemiconductor type that is different from the first semiconductor typeof the substrate 110. For example, if the substrate 110 comprises bulksilicon (Si), the first layer may comprise silicon-germanium (Site),according to one embodiment. The first layer 210 may be a sacrificialmaterial, in that at least a portion of the layer is subsequentlyremoved in a process of forming a finFET. In various embodiments, thefirst layer 210 exhibits an etch selectivity over the substrate 110,such that the first layer may be removed by an etching process that doesnot appreciably remove the substrate 110 material. The thickness of thefirst layer 210 may be any value between approximately 10 nanometers(nm) and approximately 100 nm. In some embodiments, the thickness of thefirst layer is between approximately 10 nm and approximately 50 nm.According to one embodiment, the first layer is approximately 30 nmthick.

The first layer 210 may be deposited on the substrate 110 by anysuitable means, e.g., by physical deposition or chemical deposition.According to some embodiments, the first layer 210 is deposited byepitaxial growth (using chemical-vapor deposition, for example), suchthat the first layer registers to, or is guided by, a crystallinestructure of the underlying substrate 110 and provide a crystalline thinfilm layer on the substrate 110.

The second layer 220 may comprise a semiconductor material of a sametype as the substrate 110. In some embodiments, the second layer 220 maycomprise a material different from the substrate material. The secondlayer 220 may comprise a semiconductor material desired for a fin of afinFET transistor. Regardless of the material type for the second layer220, the first layer 210 may also exhibit etch selectivity over thesecond layer 220. The thickness of the second layer 220 may be any valuebetween approximately 10 nm and approximately 100 nm. In someembodiments, the thickness of the second layer is between approximately10 nm and approximately 50 nm According to one embodiment, the thicknessof the second layer is approximately 25 nm.

The second layer 220 may be deposited by any suitable means, e.g., anymeans as described for the first layer. In some embodiments, the secondlayer 220 is deposited by epitaxial growth, such that it forms athin-film crystalline layer that registers to, or is guided by, anunderlying crystalline structure of the first layer 210. It will beappreciated that epitaxial growth of the second layer 220 can provide ahighly uniform thickness of a selected value across the multi-layersubstrate 100. A uniform thickness of the second layer can providehigher uniformity of resulting fin structures for finFETs as compared toa process which relies on etching to define fin structure height in bulksubstrates.

The mask layer 230 may be deposited over the second layer 220. The masklayer may comprise a hard mask (e.g., a metal, an oxide, a nitride) insome embodiments, and may comprise a resist or baked resist in otherembodiments (e.g., a photosensitive polymer). According to oneembodiment, the mask layer comprises silicon nitride (SiN). In variousembodiments, the mask layer exhibits etch selectivity over at least thesecond layer 220 and the first layer 210. The mask layer 230 may alsoexhibit etch selectivity over the substrate 110. The thickness of themask layer 230 may be any value between approximately 10 nm andapproximately 10 microns. In some embodiments, the thickness of the masklayer is between approximately 20 nm and approximately 100 nm. Accordingto one embodiment, the thickness of the mask layer is approximately 40nm.

A process for forming a multi-gate finFET having an underlyinginsulating layer may include patterning the mask layer 230 and etchinginto the second layer 220 and first layer 210. A resulting structure isdepicted in FIG. 2B. As an example, the mask layer 230 may be patterned(e.g., using photolithography processes) to form strips 232 of remainingmask layer that run along the surface of the multi-layer substrate.These strips may provide an etch mask for etching into the underlyinglayers. In various embodiments, the strips 232 provide an etch mask forfins of the finFET devices.

The formed fins 220 may have a width between approximately 10 nm andapproximately 150 nm in some embodiments. The widths of the fins may beuniform to within ±15% or less. In some embodiments, the formed fins 220may have a width between approximately 10 nm and approximately 50 nm.According to some embodiments, the formed fins 220 may have a width ofapproximately 30 nm. The spacings between fins may be uniform ornon-uniform. The spacings between fins may be any value between 20 nmand 1 micron or more. In some embodiments, the spacings between fins maybe between approximately 50 nm and approximately 300 nm.

The etching into the second layer 220 and first layer 210 may be ananisotropic etch, e.g., reactive ion etching in a low pressure plasma.Any suitable etching process may be used that provides substantiallyvertical sidewalls on the etched features. The etching may proceedthrough the second layer 220 and substantially to the bottom of thefirst layer 210. In some embodiments, the etch may proceed past thebottom of the first layer 210 and into the substrate 110.

Following the etching of the second and first layers, a filling material240 may be deposited on the patterned multi-layer substrate, as depictedin FIG. 2C. The filling material may be any suitable material thatexhibits etch selectivity over at least the mask layer material 230, thesecond layer material 220, and the first layer material 210. In someembodiments, the filling material 240 additionally exhibits etchselectivity over the substrate 110. According to one embodiment, thefilling material comprises an oxide (e.g., a silicon-oxide deposited bya high-aspect-ratio process (HARP)).

The filling material may be deposited to completely cover the etchedfeatures, e.g., to a height approximately equal to or greater than thefin structures shown in FIG. 2B. If the filling material 240 isdeposited to a height greater than the fin structures, the resultingstructure may be etched back and/or polished (e.g., usingchemical-mechanical polishing (CMP)) to form a planar surface 242. Theplanar surface 242 may be formed such that the CMP process stops atapproximately the top of the mask layer material 230. In someembodiments, a portion of the mask layer material may be removed duringthe CMP process. In some embodiments, the planar surface 242 may beformed near and above the top of the mask layer material.

A subsequent mask layer 250 may be deposited and patterned over thefilling material 240. The subsequent mask layer 250 may exhibit etchselectivity over the filling material 240, and may or may not exhibitetch selectivity over any of the mask layer 230, the second layer 220,the first layer 210, and the substrate 110. The subsequent mask layermay comprise hard mask material or a resist. According to oneembodiment, the subsequent mask layer 250 comprises amorphous silicon.The thickness of the subsequent mask layer may be any value betweenapproximately 10 nm and approximately 10 microns. In some embodiments,the thickness of the subsequent mask layer is between approximately 20nm and approximately 100 nm. According to some embodiments, thethickness of the subsequent mask layer is approximately 40 nm.

The subsequent mask layer 250 may be patterned into strips oriented atan angle with respect to the fin structures shown in FIG. 2B. Accordingto one embodiment, the subsequent mask layer is patterned as pseudo-gatestructures 252, as depicted in FIG. 2D. The pseudo-gate structures maycross one or more fin structures, as depicted in the drawing. Thepseudo-gate structures may cross a fin structure at approximately a90-degree angle, although crossings at other angles may be implemented.In some embodiments, the fin structures may be arranged in groups (e.g.,groups of two, groups of three, groups of any number), and a pseudo-gatestructure may cross one or more groups.

When the subsequent mask layer 250 is patterned as pseudo-gatestructures, an optical lithography photomask or reticle that is normallyused to pattern gates for the finFETs may also be used to pattern thepseudo-gate structures. Multiple use of the photomask avoids an addedcost of an additional mask. In other embodiments, a different photomaskhaving less strict design rules than a gate mask may be used forpatterning the pseudo-gate structures 252.

The multi-layer structure of FIGS. 2C and 2D may be etched to faun thestructures depicted in FIGS. 2E and 2F, according to one embodiment. Thedashed lines in the plan view of FIG. 2D indicate the locations of crosssections for the elevation views of FIGS. 2E and 2F. The etching mayremove the filling material 240 in exposed regions that are not coveredby the pseudo-gate structures 252. The etching to remove the fillingmaterial 240 may be any suitable anisotropic etch. The etching mayremove substantially all of the filling material 240 in exposed regions,though some filling material may remain as shown in FIG. 2F. In someembodiments, all of the filling material is removed in the exposedregions.

As depicted in FIG. 2F, in some regions of the substrate the finstructures become exposed following the etching. In other regions of thesubstrate, the filling material is not removed, and the fin structuresare locally supported be a combination of the filling material 240 andpseudo-gate structures 252, as depicted in FIG. 2E, for example.

In some embodiments, the structure depicted in FIGS. 2E and 2F, may besubjected to a short oxide removal etch, e.g., chemical oxide removal(COR) etch, that may remove an residual or formed oxide on the exposedsurface of the first layer 210. The structure may then be subjected to aselective etch that removes the first layer material 210 in the exposedregions depicted in FIG. 2F. The selective etch may be anistropic, e.g.,a high-pressure plasma etch or a wet chemical etch. According to someembodiments, the selective etch comprises a hydrochloric acid etch. Theselective etch may also remove at least some of the first layer materialin the regions depicted in FIG. 2E, in some embodiments. After theremoval of the first layer material, the fin structures in FIG. 2F(comprising the remaining second layer 220 and mask layer 230) becomesuspended structures with voids between the suspended structures and thesubstrate 110. Because the regions in FIG. 2E have filling material 240and pseudo-gate structures 252, they provide support to the suspendedfin structures in FIG. 2F.

A deposition process may then be carried out to fill the voids andregions around the suspended fin structures to provide a structure asdepicted in FIG. 26. The voids may be filled with an insulatingmaterial, e.g., a silicon-oxide. Any suitable insulating material may beused to insulate the second layer material from the substrate 110.According to one embodiment, the insulating material 240 is a silicondioxide deposited by a HARP procedure that is substantially the samematerial and process used to deposit the filling material 240 indicatedin FIG. 2C. The insulating material may cover the fin structures asdepicted in FIG. 2G.

After deposition of the insulating material, the processed substrate maybe annealed to improve the quality of the HARP-deposited material. As anexample, the HARP oxide may be annealed using a shallow trench isolation(STI) annealing process.

Etching and/or polishing may be carried out to remove the pseudo-gatestructures 252, mask material 230 and a portion of the insulatingmaterial 240, so as to expose the fin structures 280 in the first layermaterial 210. The removal processes may include a chemical-mechanicalpolishing (CMP) step that planarizes the surface and stops atapproximately the mask material 230 of the fin material 220. Subsequentetching, e.g., RIE etching, may be used to remove the mask materialand/or insulating material, so that the fins 280 become exposed asindicated in FIG. 2H. In the resulting structure, as depicted in FIG.2H, the fin structures have an underlying insulating layer 270, thatelectrically insulates the fin structures from the semiconductorsubstrate 110.

FIG. 21 depicts a structure obtained in an alternative embodiment of aprocess for forming a multi-gate finFET having an underlying insulatinglayer. In this embodiment, an etching step to remove filling material240 may comprise an isotropic etch of an exposed region indicated by thedotted box 245 in FIG. 2D. A resist (not shown) may be patterned overthe structure shown in FIG. 2C to define the exposed region indicated bythe dotted box 245. An isotropic etch, a semi-anisotropic etch, orcombination of isotropic and anisotropic etches may be used to removefilling material below the exposed region and, in some cases, below thepseudo-gate structures 252 to create a void region 260. The pseudo-gatestructures may still be anchored by remaining filling material 240 andprovide support to the suspended fin structures. Filling material 240may be subsequently deposited, and the overall structure polished and/oretched to yield the structure depicted in FIG. 2H.

After obtaining a structure as depicted in FIG. 2H, finFET process stepsmay be carried out to form finFETs from the fin structures 280. Forexample, an insulated gate structure may be formed over one or morefins, as depicted in FIG. 3A. An insulated gate structure may comprisean thin insulator 335 (e g., an oxide) and gate conductor 330 depositedover the fin structures 280. The insulator 335 may be a thermal oxide insome embodiments, or a vapor deposition oxide which may be subsequentlyannealed.

A gate conductor 330 may be deposited over the oxide, and subsequentlypatterned and etched to form a gate structure. A gate structure may bepatterned as a strip that serves as a gate for more than one finstructure 280. The gate conductor may comprise any suitable conductivematerial, e.g., polysilicon, a metal. The patterned gate conductor 330may serve as a mask for removing exposed regions of oxide 335 from finportions adjacent to the gate structure.

Source and drain portions 320, 340 of the fins may be formed afterforming the gate structures. In some embodiments, source and drainregions are formed by a self-aligned, ion-implantation process in whichthe gate conductor 330 serves as a mask for ion implantation. In someimplementations, spacers 332 may be formed adjacent the gate structures,as depicted in FIG. 3B. The spacers may be formed of any material (e.g.,a nitride or oxide) suitable for blocking ions during an ionimplantation process. The source and drain portions 320, 340 may extendpart way into the fin 315 in some embodiments, and may extend to thebottom of the fin in other embodiments. The fin 315 may be of a firstconductivity type (e.g., a P-type or N-type semiconductor), and thesource and drain portions 320, 340 may be of a second oppositeconductivity type (e.g., an N-type or P-type semiconductor,respectively).

A passivation layer (not shown) may be deposited over the devices shownin FIGS. 3A-3B, and gate, source and drain contacts formed through thepassivation layer. Regardless of how the gate structure and contacts areformed, the resulting finFET comprises an active finFET device that issupported by an underlying insulating layer 270. For example, eachfinFET sits on the insulating layer 270. With reference to FIG. 1B, theinsulating layer 270 prevents the flow of leakage current J that wouldotherwise occur underneath the fin in a bulk semiconductor substrate.Further the underlying insulating layer was formed below the finstructures to insulate the finFETs from the substrate, even though theprocess started with a bulk semiconductor substrate. The process doesnot require use of an SOI wafer.

It may be appreciated that that above-described processes for formingfinFETs can provide uniform fin heights over the area of a chip orwafer, since the height of the fin structures 280 is initiallydetermined by epitaxial growth or a suitable deposition process.Epitaxial growth can be a well-controlled process that provides highlyuniform fin heights over large areas. For example, over the area of achip, the fin heights may vary by less than ±15% in some embodiments,less than ±10% in some embodiments, less than ±5% in some embodiments,and yet less than ±2% in some embodiments. Additionally, some of thedeposition and etching steps used in the disclosed embodiments have wideprocess margins, since these steps are not specifically used to define aheight of a fin. For example, deposition and etching of the filling andinsulating material 240 may have wide process latitude, since the heightof the fins is defined before these steps. Also, the etching of thefirst and second semiconductor materials 210, 220 may have widelatitude, since over-etching into the substrate 110 (as in FIG. 2B) doesnot matter in terms of the performance of the finFET.

The technology described herein may be embodied as a method, of which atleast one example has been provided. The acts performed as part of themethod may be ordered in any suitable way. Accordingly, embodiments maybe constructed in which acts are performed in an order different thanillustrated, which may include performing some acts simultaneously, eventhough shown as sequential acts in illustrative embodiments.Additionally, a method may include more acts than those illustrated, insome embodiments, and fewer acts than those illustrated in otherembodiments.

Having thus described at least one illustrative embodiment of theinvention, various alterations, modifications, and improvements willreadily occur to those skilled in the art. Such alterations,modifications, and improvements are intended to be within the spirit andscope of the invention. Accordingly, the foregoing description is by wayof example only and is not intended as limiting. The invention islimited only as defined in the following claims and the equivalentsthereto.

What is claimed is:
 1. A method for making a fin-FET, the methodcomprising: depositing a first layer comprising sacrificial material ona substrate; depositing a second layer of a first semiconductor materialover the first layer; forming a plurality of fins for one or morefin-FETs in the second layer; and removing at least portions of thefirst layer to form first voids under the plurality of fins.
 2. Themethod of claim 1, wherein the substrate comprises a bulk semiconductor.3. The method of claim 1, further comprising: depositing a fillingmaterial over the formed fins; forming a support structure over thefilling material; and removing a portion of the filling material toexpose at least portions of the plurality of fins.
 4. The method ofclaim 3, wherein the support structure comprises a pseudo-gate structureand provides mechanical support to at least some fins of the pluralityof fins after the forming of the first voids.
 5. The method of claim 3,wherein the filling material comprises a low-temperature high-aspectratio oxide.
 6. The method of claim 3, wherein the forming of the finscomprises: forming a hard mask having a pattern of the plurality of finsover the second layer; and etching the second layer and first layer toform fin structures.
 7. The method of claim 6, wherein the forming thesupport structure comprises: planarizing the filling material andstopping on the hard mask; depositing a third layer; and patterning thethird layer to form the support structure.
 8. The method of claim 3,wherein the forming the support structure comprises using a samephotomask that is used to form gate structures for the plurality offins.
 9. The method of claim 3, further comprising filling at least thefirst voids with an insulating material.
 10. The method of claim 9,wherein the insulating material is an oxide.
 11. The method of claim 9,further comprising: removing the support structures, at least somefilling material, and at least some of the insulating material to exposeportions of the plurality of fins; forming at least one gate structureover the plurality of fins; and forming source and drain regions in theplurality of fins.
 12. The method of claim 1, wherein the first layercomprises a second semiconductor material and the depositing of thefirst layer comprises epitaxially growing the second semiconductormaterial.
 13. The method of claim 12, wherein the second semiconductormaterial comprises SiGe.
 14. The method of claim 12, wherein the secondsemiconductor material is deposited between approximately 10 nm andapproximately 70 nm thick.
 15. The method of claim 1, wherein depositingthe second layer comprises epitaxially growing the second layer over thefirst layer.
 16. The method of claim 15, wherein the first semiconductormaterial comprises Si.
 17. The method of claim 1, wherein the secondlayer is deposited between approximately 10 nm and approximately 70 nmthick.
 18. The method of claim 17, wherein a width of a fin of theplurality of fins is between approximately 10 nm and approximately 150nm.
 19. The method of claim 17, wherein a spacing between fins of theplurality of fins is greater than approximately 20 nm.
 20. A method formaking a fin-FET structure comprising forming a plurality of fins for aplurality of fin-FETs so that first portions of the plurality of finsthat are over voids between the plurality of fins and a substrate aresupported by a support structure adjacent the first portions.
 21. Themethod of claim 20, wherein the substrate comprises a bulksemiconductor.
 22. The method of claim 20, wherein forming the pluralityof fins comprises epitaxially growing a semiconductor.
 23. The method ofclaim 20, wherein the support structure comprises pseudo-gatestructures.
 24. The method of claim 23, further comprising supportingthe pseudo-gate structures by a filling material that is deposited oversecond portions of the plurality of fins.
 25. The method of claim 20,wherein the support structure comprises amorphous silicon.
 26. Themethod of claim 20, further comprising forming a hard mask materialbetween the plurality of fins and the support structure.
 27. The methodof claim 20, wherein the plurality of fins comprises Si.
 28. A methodfor making a fin-FET, the method comprising: forming a first layercomprising sacrificial material on a substrate; forming a second layerof a first semiconductor material over the first layer; forming aplurality of fins for one or more fin-FETs in the second layer; andremoving at least portions of the first layer to form first voids underthe plurality of fins.
 29. The method of claim 28, wherein the substratecomprises a bulk semiconductor.
 30. The method of claim 28, furthercomprising: forming a filling material over the formed fins; forming asupport structure over the filling material; and removing a portion ofthe filling material to expose at least portions of the plurality offins.